Principal Engineer (Flip-Chip, Power Packaging, SMT)

Principal Engineer (Flip-Chip, Power Packaging, SMT)

Level: Section Manager / Manager
Location: Ayutthaya, Thailand
Vacancies: 1

About the Opportunity

Evantis Talent Solutions is recruiting a Principal Engineer specialising in flip-chip technology, power packaging and/or surface mount technology (SMT) for a semiconductor manufacturer in Ayutthaya.

The role will lead new product and technology development, manage engineering activities and drive improvements in manufacturing quality, yield and performance.

Key Responsibilities

• Manage new product development involving flip-chip technology, power packaging and/or SMT.
• Integrate process improvements into new product and technology development.
• Lead new product introduction (NPI) to ensure new technologies and products meet qualification and quality requirements.
• Design, execute and analyse engineering experiments to optimise manufacturing processes.
• Improve new product yield and performance through process optimisation.
• Manage the engineering team and coordinate with assembly and test operations to investigate and resolve yield and quality issues.
• Prepare technical reports and apply statistical analysis to support engineering decisions.

Requirements

• Bachelor's degree in Electrical Engineering, Electronic Engineering, Science or a related discipline.
• Minimum eight years of direct experience in flip-chip technology, power packaging and/or SMT.
• Comprehensive knowledge of semiconductor manufacturing processes.
• Experience in new product introduction, technology qualification and process improvement.
• Ability to manage engineering teams and coordinate with assembly and test operations.
• Strong statistical analysis, problem-solving and reporting skills.
• Strong verbal and written English communication skills.
• Ability to work at the Ayutthaya plant.